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https://e2e.ti.com/support/logic-group/logic/f/logic-forum/1471943/sn74lvc1g17-requisition-for-junction-to-case-bottom-thermal-resistance-max-allowed-junction-temperature-and-case-temp-c-max-of-sn74lvc1g17dckr
工具与软件：
尊敬的 TI 团队： 您好！ 我们想知道 SN74LVC1G17DCKR 的结至外壳(底部)热阻、允许的最大结温和外壳温度(°C)最大值
您好！
请参阅以下内容：
