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https://e2e.ti.com/support/logic-group/logic/f/logic-forum/1471911/sn74ahc1g08-requisition-for-junction-to-board-thermal-resistance-junction-to-case-bottom-thermal-resistance-and-case-temp-c-max-of-sn74ahc1g08dckr
工具与软件：
尊敬的 TI 团队： 您好！ 我们想知道 SN74AHC1G08DCKR 的结至电路板热阻、结至外壳(底部)热阻和外壳温度(°C)最大值
您好！
请参阅以下内容：
