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https://e2e.ti.com/support/microcontrollers/msp-low-power-microcontrollers-group/msp430/f/msp-low-power-microcontroller-forum/693108/msp430fr2110-msp430fr2110irllt-footprint
你(们)好
是否有 RLL 封装的完整封装信息？ 当前版本(mpqf305b.pdf)没有散热焊盘或建议的焊料/焊锡膏等层。
谢谢
Simon
