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https://e2e.ti.com/support/microcontrollers/msp-low-power-microcontrollers-group/msp430/f/msp-low-power-microcontroller-forum/1394059/uc2825a-ep-thermal-data
工具与软件：
需要 UC2825AQDWREP、 SOP_16_SM_50_NS-M16B_MC 封装的热数据。
尊敬的 Moriah：
我正在内部询问、会尽快回复您。
THETA_JC_TOP 为 25.1；THETA_JC_Bottom 为24.5。
THETA_JB 为27.1。
以上结果适用于 UC2825AQDWREP 和 UC2825AMDWREP 。
