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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1486606/tlv62569-what-wafer-size-and-node-process-nm-for-tlv62569dbvr
工具与软件：
尊敬的 TI 团队：
请帮助回复 TLV62569DBVR 的晶圆尺寸和节点工艺(nm)。 谢谢。
您好、Yi Yi、
感谢您在 E2E 中提出问题。
晶圆尺寸为300mm、节点工艺为150nm。
此致、
Andreas。
