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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1500495/lm25576-thermal-resistance-junction-to-case
工具/软件：
您能告诉我结至外壳的热阻(封装顶部)吗？
嗨、Takashi、
看看 采用类似封装的其他器件、它应该约为20 -25°C/W
此致、
Niranjan
你好、 Niranjan、
感谢您的回答。
