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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1126869/csd18511ktt-thermal-resistance-from-junction-to-case-top
数据表列出了结至外壳热阻。 这是外壳顶部还是外壳底部的热阻结点？ 如果是底部、结至外壳顶部的热阻是多少？
Joey、
感谢您关注我们的 FET。
结至外壳连接到封装底部的外露金属卡舌。
数据表中未指定封装顶部的热阻、但我们估计 D2Pak 封装的热阻处于~30°C/W 典型范围内。
谢谢
Chris
