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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1033608/ucc27524-hot-pad-connection-problem
降级器、
芯片的散热焊盘是否可以连接到系统的参考接地？
谢谢！
您好！
是的、为了从 IC 中散发热量、封装底部的焊盘应该被连接至系统接地。
https://www.ti.com/lit/an/slma004b/slma004b.pdf?ts=1630931138094
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此致、
Don
