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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/970800/csd19532q5b-csd19532q5b-thermal-information-of-package
大家好、
请告诉我这一点。
1.线性热膨胀系数封装
2.封装的热导率
此致、
Kento
Sato-San、您好！
感谢您向客户推广 TI FET。 该封装的 CTE 为25ppm/°C。 封装塑料模压混合物的热导率为0.9W/mk。
