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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/758108/tps63802-footprint
大家好。
DLA 封装目前处于预发布状态。 可提供预量产样片(XPS63802DLAT)。 现在，我已经获得了几个用于评估的样本，缺少占用空间。您能否将其发送给我？
您好 Ray、
请在 e2e.ti.com/.../mpqf499b.pdf 上找到。
