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https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1311332/ucc21540-ucc21540dw-question
您好！
是否可以在 IC 焊盘中间底层布局中布线、并尽量减小隔离焊盘的爬电距离？
谢谢！
尊敬的 Maor：
是否有具体的理由尽可能缩短焊盘之间的距离？
我们确实有此器件 UCC21222的窄体封装版本、您可以查看该版本：
https://www.ti.com/product/UCC21222
此致、
广木市
