工具/软件:
您好、TI 专家
我尝试在 tispl.bin 中学习替换 DM、然后在引导时收到如下所示的错误消息。
Welcome to minicom 2.7.1
OPTIONS: I18n
Compiled on Dec 23 2019, 02:06:26.
Port /dev/ttyUSB0, 17:58:54
Press CTRL-A Z for help on special keys
U-Boot SPL 2024.04-dirty (Aug 12 2025 - 15:19:11 +0800)
SYSFW ABI: 4.0 (firmware rev 0x000a '10.1.8--v10.01.08 (Fiery Fox)')
SPL initial stack usage: 13392 bytes
Trying to boot from MMC2
alloc space exhausted
Could not get FIT buffer of 2348544 bytes
check CONFIG_SPL_SYS_MALLOC_SIZE
Authentication passed
Authentication passed
Authentication passed
Authentication passed
Authentication passed
Starting ATF on ARM64 core...
NOTICE: BL31: v2.11.0(release):v2.11.0-906-g58b25570c9-dirty
NOTICE: BL31: Built : 04:20:32, Nov 1 2024
U-Boot SPL 2024.04-dirty (Aug 12 2025 - 17:57:59 +0800)
SYSFW ABI: 4.0 (firmware rev 0x000a '10.1.8--v10.01.08 (Fiery Fox)')
SPL initial stack usage: 1904 bytes
ti_sci system-controller@44043000: ti_sci_get_response: Message receive failed. ret = -110
ti-sci-pm-domains power-controller: ti_sci_power_domain_on: get_device(186) failed (-110)
Trying to boot from MMC2
ti_sci system-controller@44043000: ti_sci_get_response: Message receive failed. ret = -110
以下是我的步骤。
(1) 使用 MCU SDK 工程“ipc_rpmsg_echo_linux_am62x-sk-lp_r5fss0-0_freertos_ti-arm-lang"来“来构建简单的 DM

(2) 将“ipc_rpmsg_echo_linux.wkup-R5f0_0.strip.out"从“从 MCU SDK 工程复制到“ti-processor-sdk-linux-am62xx-evm-10.01.10.04/board-support/prebuilt-images/am62xx-lp-evm/ti-dm/am62xxxx、并将文件名替换为“ipc_release.xf_exc_sne",“,因为、因为

(3) 重新编译带 DM 的 tispl.bin、脚本如下所示。
$ cd ~/ti-processor-sdk-linux-<version>/
$ pwd
$ export SDK_INSTALL_DIR="/home/gibbs/work/am62_lp/ti-processor-sdk-linux-am62xx-evm-10.01.10.04"
$ export CROSS_COMPILE_64="${SDK_INSTALL_DIR}/linux-devkit/sysroots/x86_64-arago-linux/usr/bin/aarch64-oe-linux/aarch64-oe-linux-"
$ export SYSROOT_64="${SDK_INSTALL_DIR}/linux-devkit/sysroots/aarch64-oe-linux"
$ export CC_64="${CROSS_COMPILE_64}gcc --sysroot=${SYSROOT_64}"
$ export CROSS_COMPILE_32="${SDK_INSTALL_DIR}/k3r5-devkit/sysroots/x86_64-arago-linux/usr/bin/arm-oe-eabi/arm-oe-eabi-"
$ export UBOOT_DIR="${SDK_INSTALL_DIR}/board-support/ti-u-boot-2024.04+git"
$ export TI_LINUX_FW_DIR="${SDK_INSTALL_DIR}/board-support/prebuilt-images/am62xx-lp-evm"
cd board-support/ti-u-boot-<version>
$ // no need to rebuild tiboot3.bin
$ // let's rebuild tispl.bin
$ make ARCH=arm CROSS_COMPILE="$CROSS_COMPILE_64" am62x_evm_a53_defconfig O=$UBOOT_DIR/out/a53
$ make ARCH=arm CROSS_COMPILE="$CROSS_COMPILE_64" CC="$CC_64" BL31=$TI_LINUX_FW_DIR/bl31.bin TEE=$TI_LINUX_FW_DIR/bl32.bin O=$UBOOT_DIR/out/a53 BINMAN_INDIRS=$TI_LINUX_FW_DIR
(4) 将 tispl.bin 复制到 SD 引导分区。
我已经参考了这些文档。
https://dev.ti.com/tirex/explore/node?node=A__AEIJm0rwIeU.2P1OBWwlaA__AM62-ACADEMY__uiYMDcq__LATEST
我是否错过了一些东西?
谢谢你。
Gibbs



