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Other Parts Discussed in Thread: AM5728
https://e2e.ti.com/support/processors-group/processors/f/processors-forum/666134/am5728-thermal-relief-on-via-in-pad-to-gnd
使用焊盘中过孔的 AM5728布局 ：(每个接地焊盘都有一个直接通向接地层的过孔) 为了确保 BGA 焊接正确， 是否需要在这些过孔与接地层相符合的地方进行散热？
(出于散热原因、我们希望尽可能避免使用散热器。)
