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https://e2e.ti.com/support/tools/simulation-hardware-system-design-tools-group/sim-hw-system-design/f/simulation-hardware-system-design-tools-forum/1569978/tida-010237-placement-of-the-burden-resistor
工具/软件：
例如、与 DRV401 在电桥中驱动绕组、且检测电阻位于电桥的低侧（脚点）中相比、将检测电阻放置在激励绕组的中间有哪些优缺点？
