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https://e2e.ti.com/support/tools/simulation-hardware-system-design-tools-group/sim-hw-system-design/f/simulation-hardware-system-design-tools-forum/873530/webench-tools-cc2640r2f-how-to-should-select-plating-connector-cc2460r2f-bluetooth-interface-connection-to-mainboard-msp430f6779a
工具/软件：WEBENCH设计工具
由于我 分离了主板和 BT 板、问题在于连接器的镀层。 问题是、
如何选择适合此功能(通信主板和 BT 板)的最小镀层选项？
您现在似乎已经在 https://e2e.ti.com/support/tools/sim-hw-system-design/f/234/t/870211上获得了这方面的答案
设计工具 
