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https://e2e.ti.com/support/switches-multiplexers-group/switches-multiplexers/f/switches-multiplexers-forum/863672/sn74cb3q3257-coefficient-of-thermal-expansion-cte-for-part-number-sn74cb3q3257rgyr
我正在对使用大量 TI 器件的电路板进行焊点疲劳分析。 您能告诉我器件型号 SN74CB3Q3257RGYR 的热膨胀系数(CTE)吗？
提前感谢您的帮助！
尊敬的 David：
SN74CB3Q3257RGYR采用铜作为基底金属和预镀镍钯金涂层。 这两种⁰C 的 CTE 分别约为17ppm/μ s 和13ppm/μ s。
此致、
Saminah
感谢您的帮助！
