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TMS320F28333: The BGA package has some scratches and contamination (P/N:TMS320F28335ZHHA)

Part Number: TMS320F28333

Hi  Dear , we recently bought a package of goods from DIGIKEY  (P/N:TMS320F28335ZHHA). After the appearance inspection, we found some scratches and contamination. Is this a normal phenomenon? Will it affect use? See picture for details.We are very grateful for your valuable answers !

 

  • Hi Nelson,

    We have included subject matter expert. He will get back to you by tomorrow.

    Thanks & Regards,

    Yale Li

  • HI Yale ,Thank you very much !

  • These appear to be minor level of surface scratches on the substrate and probably were present before solder ball attach. They don't appear like the scratches go deep enough to  interfering with the copper traces underneath. If they didn't, then would have expected an open connection.

    We don't see any contamination in these pictures. Only comment I would have is on the solder ball shape in top row, 2nd ball in the first picture. The potentially looks like solder smear out from the solder ball. If it is, it could bridge to the solder ball above it. However, it may not be solder but a foreign particle such as nylon that just has a bright appearance. Before leaving the TI factory, each solder ball undergoes a 100% automatic visual inspection. 

    As a further check, if you give us the lot trace code for this device we can take a look at manufacturing records for this lot.

  • Hi ~ 

    Thank you for your professional answers . And the LOT NO is 2094849PHI . Thanks again.

  • Hi Nelson,

    I followed up this information with the relevant engineer. I will get back to you ASAP after receiving a reply.

    And If you have similar issues(like quantity issue) in the future, you can go to CSC and ask for help: 

    https://support.ti.com/csm

    E2E forum mainly support technical issue.

    Thanks

  • Hi Yale  

    Thank you for your help. Have good day. 

  • Thanks Nelson. I'm waiting for a reply. And thanks for your patience.