MSP430F2132的XIN和XOUT接4M的外部晶振,功耗有3mA之多,把外部晶振关闭,用内部DCO=8M,功耗才3mA。
请问这正常吗?
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
MSP430F2132的XIN和XOUT接4M的外部晶振,功耗有3mA之多,把外部晶振关闭,用内部DCO=8M,功耗才3mA。
请问这正常吗?
代码如下
DCOCTL = 0;
BCSCTL1 |= XTS; // ACLK = LFXT1 = HF XTAL
BCSCTL3 = LFXT1S_2+XCAP_0; // 4MHz
do
{
IFG1 &= ~OFIFG; // Clear OSCFault flag
for (i = 0xFF; i > 0; i--); // Time for flag to set
}
while (IFG1 & OFIFG); // OSCFault flag still set?
BCSCTL2 = SELM_2+SELS+DIVM_0; // MCLK = LFXT1 (safe)
使用4M的晶振,功耗为2.8mA。
按道理讲,不应该这么大啊。将MCLK进行2分频后功耗为2.2mA,VCC=3.3V
官方案例太坑了,无意间改成这个:
DCOCTL = 0;
BCSCTL1 = XTS; // ACLK = LFXT1 = HF XTAL
BCSCTL3 = XT2S_2; // 3~16MHz crystal or resonator
do
{
IFG1 &= ~OFIFG; // Clear OSCFault flag
for (i = 0xFF; i > 0; i--); // Time for flag to set
}
while (IFG1 & OFIFG); // OSCFault flag still set?
BCSCTL2 = SELM_2+SELS+DIVM_0; // MCLK = LFXT1 (safe)
IFG1 = 0; // 清中断标志寄存器
竟然好了