Part Number: MSPM0-SDK
问题出现在烧写固件时，烧写过程进行了一半，SWD接口松动，中断了烧写，再次烧写无法就进行了，于是恢复出厂设置失败，下面是log,使用的是UiFlash.
1.尝试在CCS中使用Project-lss debug把SWD时钟降低为100K，然后恢复出厂和Mass Erase依然无效
2.这个问题发生了很多次，因为我们使用的是顶针式的烧写口，必须用收扶住才能烧写。但应该可以在烧写失败时能重新烧写才对啊。
[2026/8/28 下午12:06:50] [INFO] CS_DAP_0: GEL Output: Initiating Device Mass Erase [2026/8/28 下午12:06:50] [INFO] CS_DAP_0: GEL Output: Attempting CS_DAP connection [2026/8/28 下午12:06:51] [INFO] CS_DAP_0: GEL Output: Attempting SEC_AP connection [2026/8/28 下午12:06:51] [INFO] CS_DAP_0: GEL Output: Command Sent [2026/8/28 下午12:06:52] [INFO] CS_DAP_0: GEL Output: Start hardware Reset using NRST [2026/8/28 下午12:06:52] [INFO] CS_DAP_0: GEL Output: Initiating BOOTRST Board Reset [2026/8/28 下午12:06:52] [INFO] CS_DAP_0: GEL Output: Reset line asserted [2026/8/28 下午12:06:52] [INFO] CS_DAP_0: GEL Output: Reset line de-asserted [2026/8/28 下午12:06:52] [INFO] CS_DAP_0: GEL Output: Board Reset Complete [2026/8/28 下午12:06:52] [INFO] CS_DAP_0: GEL Output: Reset done [2026/8/28 下午12:06:52] [INFO] CS_DAP_0: GEL Output: SEC_AP Disconnect [2026/8/28 下午12:06:52] [INFO] CS_DAP_0: GEL Output: SEC_AP Reconnect [2026/8/28 下午12:07:12] [ERROR] CS_DAP_0: Trouble Reading Register SECAP_RCR: (Error -2131 @ 0x2020C) Unable to access device register. Reset the device, and retry the operation. If error persists, confirm configuration, power-cycle the board, and/or try more reliable JTAG settings (e.g. lower TCLK). (Emulation package 20.2.0.3575) [2026/8/28 下午12:07:12] [ERROR] CS_DAP_0: GEL: Error while executing GEL_DAPInit_SECAPCommand(): Target failed to read register SECAP_RCR at ('REG'::SECAP_RCR&0xFFFFU) [mspm0_cs_dap_init.gel:247] at GEL_DAPInit_WaitForResponse() [mspm0_cs_dap_init.gel:426] at GEL_DAPInit_SECAPCommand()
