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使用MSP430F5172RSB40，封装为WQFN，给的layout图形上有散热焊盘，不知道这些散热焊盘需要接地吗？还是浮空就行
一般来说，芯片底部的散热焊盘是要接地的，并且大焊盘上可以放置过孔，通过过孔将热量传导到背面增加散热面积。
QFN pad Recommended to connect to DVSS externally
WQFN是QFN的一种形式，具体请见：http://www.ti.com/sc/docs/psheets/type/wqfn.html
谢谢！
