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MSP430F2619SPM 手册上说的最高使用温度是150摄氏度，怎么做高温试验时，环境温度在135摄氏度32.768kHz晶振信号就变成了直流，晶振本身是175摄氏度的，单独晶振的150摄氏度高温试验，晶振信号正常？
这个是为什么呢？
实验时建议用内部dco。因为不只mcu和晶振的问题，pcb走线在高温下也会受到影响
