UCC28711: internal lead-frame protrusions

Part Number: UCC28711

Hi TI team,

We are currently evaluating the UCC28711DR and during our X-ray inspection, we observed some anomalies that we would like to clarify.

As shown in the attached X-ray images, there appear to be internal lead-frame protrusions on the side of the body of the device. These protrusions extend outward from the main lead-frame structure and are visible on both the top and side views under inspection.

We have highlighted the areas of concern in the images for reference. Could you please help confirm:

  1. Are these protrusions a normal characteristic of the lead-frame design for this device?
  2. Could they potentially impact the mechanical or electrical reliability of the part, such as the risk of short circuits or die attach integrity?
  3. Is there any known process variation that could cause such features, and do they fall within TI's standard acceptance criteria?

Any clarification or guidance would be greatly appreciated.

Thank you

  • Thank you for contacting TI China E2E forum and choosing our products as part of your solution. Regarding your query, please give us some time to confirm this issue.

  • The TI E2E Forum is designed to address technical issues customers encounter while designing with TI products.
    Your problem is in the category of process and chip quality issues.
    It is recommended that you contact Customer Support as described below and a customer service will be available to assist you.
    Open the link ticsc.service-now.com/csm
    Click the "Submit an Application for the Family" button under "Request a New Support"
    In the newly opened window, click "Quality. "Create a case for the "Family" button under Reliability and Environmental Information
    In the form that opens, you can describe your problem in Chinese and submit it.
    A specialist will be at your service.

  • Thank you for your reply. I followed the instructions you provided, but it appears that the current webpage structure may have changed, and I was unable to find the entry points you described. Specifically:

    1. When opening `ticsc.service-now.com/csm`, the page remains stuck in a loading/redirecting state and does not display the "Request a New Support" or "Submit an Application for the Family" buttons you mentioned.
    2. I also tried navigating through the "Support & Quality" section on TI.com.cn, but still could not find a submission path that matches your description.

    Could you please provide an updated guide or a direct link? For example, is there a way to submit a quality-related case directly through my TI account page? Or is there an email address I can use to send the X-ray inspection results and a description of the issue to the relevant team?

    I look forward to your further guidance. Thank you.