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是的，原理图和PCB画完，对照Check list 查一下 http://processors.wiki.ti.com/index.php/CC26xx_HW_Checklist
第2步就是检查ECG是否接地。
Verify that all component values are correct. For the RF components and the DCDC-inductor it is also recommended to use the same part numbers.
Verify that the Exposed Ground Pad (EGP) is connected to ground.
Check that the crystals are within the required spec. (see CC26xx datasheet and CC26xx Crystals article)
Note that CC26xx has an internal load cap array on the 24 MHz crystal pins. The cap array supports load cap values from 0 to 10 pF (default setting is CL = 9 pF)
Note that using crystals with lower CL will decrease start-up time and power consumption. The same is true for lower Lm (motional inductance)
Are antenna matching components included?
Ensure that all IO connections are correct (analog functionality, 8 mA capability and sensor controller connection is limited to certain pins).
Do you need to support Over-the-Air Download (OAD) for updating BLE firmware? If so, consider adding provisions for external serial EEPROM (i.e., SPI flash) to your board if your application size is not able to meet the code size limitations for on chip OAD which is dependent on the product and SDK release. Use the CC2640R2F LaunchPad design files as a reference for adding external SPI flash (applies to all CC26xx BLE designs).
