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MCU-PLUS-SDK-AM273X: AM273X,2243级联

Part Number: MCU-PLUS-SDK-AM273X
Other Parts Discussed in Thread: AWR2243

请问我用mmwave_mcuplus_sdk_04_04_01_02的双芯片级联采数工程(mmwave_mcuplus_sdk_04_04_01_02\mmwave_mcuplus_sdk_04_04_01_02\ti\utils\test\cascade\am273x);

工程默认的采数模式应该是DDMA吧,现在我想把工程修改为TDM模式采数;

在代码里把配置改为

profileCfg 0 77 7 7 20.83 0 0 11 256 20000 0 0 42
chirpCfg 0 0 0 0 0 0 0 1
chirpCfg 1 1 0 0 0 0 0 4
chirpCfg 2 2 0 0 0 0 0 2
frameCfg 0 2 16 400 256 100 1 0;

但采出来的数据大小与我们预想的差了一倍;

预想数据大小为采样点数(256)*点数大小(4)*发射天线*接收天线(48,考虑MIIO,级联变为6发8收)*chirp数(16)*采样帧数(400 );

实际采数大小=预想数据大小/2;

猜测是不是级联采数所修改的TDM模式,是两芯片单独工作,没有MIMO成48个虚拟通道,而是2*TX*RX=24个通道