TIDEP-01032: Is there any documentation supporting the resistance between the metal casing of the chassis controller used in automotive electronics and the ground plane of the circuit board?

您好，

 方便用图示详细说明吗？

OR is there any document about "shielding grounding" that "Use a 10MΩ resistor and 10nF capacitor in parallel from shield to PCB ground"?

OR  is there any document about "Chassis-to-PCB Ground Connection" that "a high-value resistor (1MΩ to 10MΩ) in parallel with a capacitor (typically 10nf) is required between the metal enclosure and PCB ground."

This circuit of ECU is used in the system of chassis after all

 H8001 is the locating hole connected with metallic case，R8005 is the resistor between metallic case and GND.

Is there any documentation supporting the resistance between the metal casing of the chassis controller used in automotive electronics and the ground plane of the circuit board?

If this resistance（R8005） was 0Ω, what risks would be caused?

您好，

     对于外壳地于电源地连接方法：单点接地  阻容并联隔离方案

     很难说单点接地和阻容并联谁更为可靠。

     对于阻容并联隔离方案：

      推荐使用1~100nF/1KV高压电容并联1~2MΩ电阻：
      电容作用：通高频阻低频，抑制共模干扰并将高频噪声导入机壳地. 一般而言，Cy电容器因其安全特性而被选用。

      电阻作用：缓慢释放静电电荷，防止累积高压击穿元器件，需满足IEC61000标准10秒内释放2kV电荷的要求