Hi TI team,
My side faced a chip shortage problem for chip UCC33020RAQR during PCBA manufacture , and there are some unused PCBAs with normal function which were manufactured in Sep of year 2025 (2 month ago), we decide to remove the UCC33020RAQR chips from the old PCBA by heat gun and reuse them on the new PCBA by normal re-flow soldering process, but I checked the SLUA271C application note and found your side don't recommend to reuse the QFN chip after it is removed, can you please help to explain the reason and give some comments for below questions?
- How to control the quality and product reliability if we insist on using the reusabled chips?
- What is the potential risk if we insist on using the reusabled chips?
- What is the best soldering temperature during chip removing process by using the heat gun? Any other rework application note related to the heat gun?
Looking forward from you support, thanks!
