LM385-1.2: X-RAY found a large number of gaps in the bonding between the internal wafer and the frame

Part Number: LM385-1.2


The part number I purchased:LM385Z-1.2/NOPB ,After X-RAY inspection, it was found that there were many voids at the epoxy resin silver adhesive joint between the internal wafer and the frame base, Please take a look at the picture!These voids exceed the military standard MIL-STD-883 and are considered qualified if they are less than or equal to 50%It is obvious that the holes in the picture exceed 50% ,Because this part is of commercial grade, can military grade standards be used to determine whether it is qualified or unqualified? I want to know if it is qualified or unqualified, Does your company conduct X-ray testing before leaving the factory?
Looking forward to your reply, thank you!
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