Part Number: BQ40Z50-R1
Other Parts Discussed in Thread: BQ40Z50
Dear TI Technical Support Team,
Our company is currently using the BQ40Z50 chip in mass production projects. For the needs of product reliability verification, supply chain cost analysis and production process matching, we sincerely ask for your assistance to provide the core process parameters of this chip, the specific requirements are as follows:
1. The wafer diameter used in the official mass production batches of BQ40Z50 (please specify whether it is 200mm/8 inches or 300mm/12 inches);
2. The process node and process type corresponding to this chip (such as specific information like 130nm BCD high-voltage process);
3. The die size of the chip (including length × width specification and die area).
Please provide official and accurate data. If some internal confidential information is involved, non-public reference values applicable to the project can be provided. Thank you for your support and assistance!
