Part Number: REF34-Q1
关于基准源的热迟滞信息,手册中提到需要测试该参数前PCB需要150度先烘烤30分钟,再降低到25度,然后进行正式的热迟滞试验。
请问这个PCB烘烤,是指芯片已经做过回流焊,焊接到PCB上,然后一起烘烤,还是仅单独烘烤PCB,芯片不参与烘烤?应用场景中如果比较关注这个指标,是不是也要先将组件进行高温烘烤?

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