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最近选了这两款芯片，焊盘间距只有0.4mm，焊盘0.23，过孔打在上面官方demo板大概在6mil（0.152），但是加工嘉立创这些一般要求0.2mm，不知道你忙怎么处理的？
选这类芯片，要求加工厂具备处理这些DSBGA的封装的能力。
