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BQ27546芯片是15引脚的BGA封装，该封装引脚与引脚之间的间距小于10mil，无法在Altium Designer进行电气走线，请问中间的引脚如何走线呢？能否引脚的焊盘设置为通孔，在Bottom Layer层引出？
可参考其他CSP封装的EVM走线
两个圆形焊盘圆心之间的距离是0.5mm，但是去掉两圆心之间的直径，边缘相距0.25mm，大概是9.8mil，这种间距是无法走线的，那如何处理中间一排的引脚走线问题？
