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想请教一个关于TPS63710PCB布线的问题

shangsu ding
Prodigy 30 points
Other Parts Discussed in Thread: TPS63710

TPS63710（WSON封装） 在AD中布线时显示中间的地上的四个焊盘，clearence constraint<0mil between pad on mulitylayer and pad on top layer。那么该如何布地线呢？还有在datesheet中四个是VIA不是PAD啊，官网上下载的模型怎么会是pad呢？