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TPS3895ADRYR和TPS22964CYZPR 是否能满足以下规格

Arking Chiu
Prodigy 40 points


Hi Team,

 请问TPS3895ADRYR和TPS22964CYZPR是否能满足以下规格呢？

电源IC
Power IC

建议不选2.5D/3D封装的电源IC，必须专项沟通与验证
Power IC encapsulated by 2.5D/3D is not recommended to select, unless approved by technical communication and verification

电源IC
Power IC

优选金线键合，禁选纯铜键合，其它键合工艺(钯铜等)需专项沟通。
Recommended gold wire bonding, pure copper bonding is forbidden, others need to communicate with Huawei

电源IC
Power IC

对于WLCSP封装，优选RDL结构，慎选Direct Bumping(FOC)结构；无论是RDL结构还是FOC结构，禁选无UBM、无PI/PBO的工艺。
For WLCSP  IC, the RDL structure is  recommended, and the Direct Bumping (FOC) structure needs to be carefully selected;  Regardless of the RDL structure or the FOC structure, the process without UBM and without PI/PBO is prohibited