hi Team
Request die attach 、thermal pad thermal conductivity and die size (real heat source) for thermal simulation.
Thanks a lot
Kevin
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hi Team
Request die attach 、thermal pad thermal conductivity and die size (real heat source) for thermal simulation.
Thanks a lot
Kevin
Hi
是的,这个信息我们也没有(因为datasheet没有,其他芯片也没有,一般可以认为发热位置是热pad位置)