Hello,
We have questions about TPS62136.
What is the wire bonding type of TPS62136, gold wire or copper wire？
When excessive MOSFET current causes the package to burn, which portion of the chip will melt first, the wire or the pad of package？
Is it possible that the pad of the chip will be burned？
The reason why I ask this question is that we have DCDC failure cases from other suppliers.
The failure mode is that the chip pad is burned, resulting in the burning of our PCB pad, then resulting in the scrapping of our PCBA.
This failure is very serious, so we intend to replace it with TPS62136.
Before replacement, we need to know more about the failure mode of TPS62136 in case of MOSFET overcurrent.
