Provide case details or comments: During SMT waiting for welding (only printing solder paste) process, we checked 100% with a multimeter and found a short-circuit phenomenon. The defect rate reached 2% This indicates that TLV70033QDDCRQ1 will fail after printing solder paste（It's not welded yet）. Then we measured ESD at all locations of the printed solder paste, Not more than TDS recommended ESD(less than +/-2000);
Question 1 ：We hope to get technical support from TI to help confirm and evaluate whether IMI production conditions will cause IC breakdown failure mode？ Whether the IMI production conditions meet the usage conditions of TLV70033QDDCRQ1？ Not more than TDS recommended ESD(less than +/-2000);
