项目中使用UCC27516,
关于datasheet描述芯片底部的thermal pad不可以直接连接到其他pin,但可以连接到GND,
该GND与芯片的引脚的GND为同一GND应该没有问题吧?
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项目中使用UCC27516,
关于datasheet描述芯片底部的thermal pad不可以直接连接到其他pin,但可以连接到GND,
该GND与芯片的引脚的GND为同一GND应该没有问题吧?
Hi
见datasheet描述: Note that the exposed pad in DRS package is not directly connected to any leads of the package. However, the DRS package is electrically and thermally connected to the substrate of the device which is the ground of the device. TI recommends to externally connect the exposed pads to GND in PCB layout for better EMI immunity.