This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
我们在一个新机器上使用TPS54331,测试在20V输入,2.3A,5.11V输出时, IC外壳温度上升超过60K,如果附近的AMPLIFIER工作的话,温升超过75K,有点危险. 已经在IC下方的打有5个0.9mm过孔, 请问,对散热而言,这些过孔做通风空孔好还是完全进锡(封闭孔)好?
封闭的话成本会比较高，还是先用通风孔。建议减小过孔直径，增加数量，同时加大铺地面积。具体请参考附件。
