你好,
我们使用两颗BQ76930芯片,通过级联的方式作出20S1P(18650)的电池管理方案;在电池组批量生产过程中,出现了一部分主板损坏的现象。
通过初步分析,是高侧(B11-B20)的BQ76930损坏了,B11的采样脚对B10采样脚短路,万用表测量仅约0.3Ω。
这对我们的生产造成了困扰,我有两个问题希望可以得到解答,
1.电压采样线的焊接顺序对芯片有没有影响;
2.什么原因会造成两个采样脚短路的现象呢?
诚盼回复,谢谢
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您好,请参考下面内容:
It is difficult to know exactly why these pins were damaged. When exactly in the manufacturing process was these discovered to be damaged?
It may be the way the cells are being attached, for best robustness they should connected starting from the bottom of the stack. They may want to add a Zener/Schottky diode on VC0 to protect the pin from too low or high voltages (This pin is a low-voltage pin).
Additionally, it may be good to read Section 10 Random Cell Connection – Within Limits of the bq769x0 Family Top 10 Design Considerations application note.
It could also be that there was an ESD strike, were there ESD considerations done in their schematic/layout?
We have a stacked reference design that could be used as reference: TIDA-01093