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请问一下，这两款芯片的thermal pad 是否可以不接地呢？还有如果自己制作pcb工艺有限应该如何对芯片进行散热呢？
引脚说明上有这么一句话:
Thermal Pad 9 – GND terminal must be electrically connected to the exposed pad on the printed circuit board for proper operation.
看来这就是一个地引脚, 为了散热, 还是接地吧.
如果连接, 可参考一下数据手册的 LAYOUT 的参考图.
