Other Parts Discussed in Thread: BQ76952
你好,
在我的板子上有DCDC芯片降压为5V,然后5V再通过LDO降压为3.3V给MCU及外围器件供电,MCU通过IIC和BQ76952进行通讯,想请问下:BQ76952的17脚VSS直接和MCU的地直接连接好,还是中间通过0R电阻进行单点接连接好?
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你好,
在我的板子上有DCDC芯片降压为5V,然后5V再通过LDO降压为3.3V给MCU及外围器件供电,MCU通过IIC和BQ76952进行通讯,想请问下:BQ76952的17脚VSS直接和MCU的地直接连接好,还是中间通过0R电阻进行单点接连接好?
您好,请参考下面内容:
The ground you select for your MCU will depend on your design expectations. When placed post-shunt, it is possible for the signals to be modulated in events of large transients where there is a larger drop across the shunt resistor and PACK- and VSS ground are different.
There is a good discussion on this on the following E2E post: https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/959098/bq76952-ground-rail-voltage-difference