Want to ask, the current use of the environment is the input voltage 9-16V output voltage 12V output current 5A. The package of this chip is relatively small, and the grounding pad is relatively small, and the heat dissipation environment of the chip itself will be relatively poor. There is no recommended external heat dissipation method in the chip specification book. I would like to ask if there is any recommended heat dissipation method under the current heating condition. The heat dissipation simulation result given by our heat dissipation engineer is that the chip surface temperature is 96°. Will it affect the normal use or life of the chip?
