按照program_evm文件夹里面的说明用DSS脚本烧写镜像EEPROM/NAND/NOR镜像。
开始出现一个问题，在wiki上查到是由于CCS版本的原因：光盘提供的是5.0版的配置文件ccxml，所以不能连接，我用5.1的CCS生成的目标版替换后，那个错误消失。但烧写镜像总是出现如下校验错误，请问是不是板子的问题。
D:\Laboratory\todo\C6670\program_evm>%DSS_SCRIPT_DIR%\dss.bat program_evm.js TMD
SEVM6670LE-le
board: evm6670l
endian: Little
emulation: XDS560 mezzanine
binaries: D:\Laboratory\todo\C6670\program_evm/binaries/evm6670l/
ccxml: D:\Laboratory\todo\C6670\program_evm/configs/evm6670l/evm6670le.ccxml
Start writing eeprom50
Writer:D:\Laboratory\todo\C6670\program_evm/binaries/evm6670l/eepromwriter_evm66
70l.out
Image:D:\Laboratory\todo\C6670\program_evm/binaries/evm6670l/eeprom50.bin
EEPROM Writer Utility Version 01.00.00.04
Writing 52800 bytes from DSP memory address 0x80000000 to EEPROM bus address 0x0
050 starting from device address 0x0000 ...
Reading 52800 bytes from EEPROM bus address 0x0050 to DSP memory address 0x80010
000 starting from device address 0x0000 ...
Verifying data read ...
Failure at byte 11, expected 0x000000ef, read 0x000000ef
EEPROM read verify failed
EVM型号是TMDSEVM6670LE，Rev.3A版的，烧写程序用的是光盘里的，但是光盘里面的说明全是TMDX的，请问这两者区别大不大。
