K2E开发板的LM10011 DAC中MODE引脚既可以选择接高电平或者低电平来选择模式,电路原理图中R611和R612都有,这样会导致短路。开发板实际上只焊接了R611,所以我想问一下有没有相关文档来总结开发板实际焊接了哪些元器件,哪些没有?
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请参考如下链接:
http://www.ti.com/tool/xevmk2ex
Hi
BOM表中没有吗?或者你对比下这个原理图,PCB和你手上的呢