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请问：TMS320C66X系列的DSP可不可以用采用一般的芯片铝散热片，芯片和散热片中间涂一层导热硅胶？
这个要结合下面的keystone散热设计手册和你用的散热片特性看是否能保证芯片工作在正常的结温范围，得根据芯片的工作环境进行散热分析设计。
请参考下面的文档。http://www.ti.com/lit/an/sprabi3a/sprabi3a.pdf
