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Hi Sir
在Datasheet 內有提到pad尺寸及via孔建立數量，
請問:
1.Thermal pad內是否也要一起建立via孔？
2.不打via孔只有銅箔的周圍打via是否會影響其特性？
thanks
BR
Yimin
请问是否有参考过下面的应用报告？2.4 Thermal Vias www.ti.com/.../slma002g.pdf
