This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
The picture1.2 shows that the device is identifying abnormal phenomena.
The picture3 shows that the side substrate is damaged.
The picture4 shows that there are many remainder on the reverse welding ball.
The picture 5.6.7shows that the surface of the solder ball is not smooth and uneven.
Dear TI,
The following order number, 1780520, material SM32C6415EGLZ50SEP 45pcs, test 2pcs, abnormal detection, specific detection situation please see the following description, please help explain the explanation, thank you!
the device is identifying abnormal phenomena and the side substrate is damaged, there are many remainder on the reverse welding ball. the surface of the solder ball is not smooth and uneven.