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material SM32C6415EGLZ50SEP 45pcs, test 2pcs, abnormal detection, specific detection situation

The picture1.2 shows that the device is identifying abnormal phenomena.

The picture3 shows that the side substrate is damaged.

The picture4 shows that there are many remainder on the reverse welding ball.

 

The picture 5.6.7shows that the surface of the solder ball is not smooth and uneven.

 

 

  • 您发的图片显示不出来,另外,这里是中文论坛,可以用中文交流。
  • 您发的图片显示不出来,另外,这里是中文论坛,可以用中文交流。
  •  Dear TI,

    The following order number, 1780520, material SM32C6415EGLZ50SEP 45pcs, test 2pcs, abnormal detection, specific detection situation please see the following description, please help explain the explanation, thank you!

    the device is identifying abnormal phenomena and the side substrate is damaged, there are many remainder on the reverse welding ball. the surface of the solder ball is not smooth and uneven.

  • 你好,如下订单编号1780520,物料 SM32C6415EGLZ50SEP 45pcs 抽检2pcs,检测出现异常,具体检测情况是说正面标识周围有异常现象,侧面基板有不同程度的破损,器件焊球表面不光滑,凹凸不平,而且周围有多余物,请帮解释说明,谢谢!为啥图片显示不出来呢,你们有关于此问题的邮箱吗,我把检测报告发给你们看下
  • 如果觉得芯片有质量问题,并且是从TI授权代理商购买的话,请联系您的购买渠道向TI递交RMA(Return Material Analysis)申请。
  • shine,刚收到你邮件,我们就是在TI store 官网直接下单买的,订单编号为1780520,物料 SM32C6415EGLZ50SEP 45pcs 抽检2pcs,检测出现问题的,你能把邮箱地址告诉我吗,我把Invoice和检测报告给你,谢谢
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