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DSP5509A编程调试中,会将DSP内部破坏而导致连接不上仿真器吗

我现在在用公司的5509A板子编程,此板子作为产品已经稳定生产及销售了6年,现在要修改点功能。

调试的程序是烧写代码到i2c EEPROM和SD卡,以及二次引导的代码(此代码是烧写到i2c eeprom中的),有两次运行代码时CCS软件卡死并且断电重连后连接不上仿真器(多次尝试都不可以连接),换块板子可以,由于这个不知情况的问题我已经让两块板子都连不上仿真器了(这两块板子不知道怎么修)。

可以确定的是仿真器没有问题(其他同样的板子都可以连接),电路板设计也不会有问题(已经稳定生产并销售了),不太能确定的是,电路板现在是什么问题(是DSP已经坏了还是JTAG上的电阻什么的已经坏了),我所做的只是修改代码并调试,感觉不会使得JTAG电路出现问题,故想问下,调试程序会破坏DSP内部吗?

希望能给点建议,是否需要测量下JTAG口的电压?测量的话可以参考哪个文档?

 环境是:ccs3.3和xds560

仿真器连不上的信息为: Error connecting to the target:

Error 0x80000242/-1143

Fatal Error during: Memory, Initialization, OCS,

The memory at 0x000000BE continually indicated it was 'not ready'

All memory operations currently in progress were aborted in order to regain control of the processor.

This is considered a catastrophic event, but the debugger should still be able to access memory and CPU registers. System state has been altered. It is strongly advised that the processor should be reset before resuming execution,

Sequence ID: 0

Error Code: -1143

Error Class: 0x80000242

Board Name: C5509 XDS560

Emulator Cpu Name: CPU_1