SMJ320C6701的MECHANICAL DATA尺寸数据是否有误

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The GLP package was originally released with the swaged or “top hat” solder sealed lid.   Several years ago it was changed to a seal ring and a welded flat lid.  The drawing apparently was not updated. 

 The seal ring and lid configuration is the same for the GLP package ceramic flip chip ball grid array (CFCBGA) and the ZMB ceramic flip chip land grid array (CFCLGA). 

 This was documented in PCN 20070809002 (attached).

8547.PCN20070809002_Final.pdf