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AM62A7: Thermal resistances are different

Raffaele Zhang
Prodigy 10 points
Part Number: AM62A7

The thermal resistances of AM62A7 in different data source are not same，and which can be used for thermal simulation?

In the thermal model is at below, R_JC=1.36, R_JB=1.7

But in the data sheet https://www.ti.com/lit/ds/symlink/am62a7-q1.pdf?ts=1698213879249&ref_url=https%253A%252F%252Fwww.ti.com%252Fproduct%252FAM62A7-Q1is at below, R_JC=0.77, R_JB=3.3

  • 0
    TI__Mastermind 27060 points

    Hello，

    If the thermal resistances of AM62A7 in different data sources are not the same, it can be difficult to determine which value to use for thermal simulation. However, the values provided in the thermal model you have provided can be used as a starting point.

    The thermal model you have provided includes a value for the junction-to-case thermal resistance (R_JC) of 1.36°C/W and a value for the junction-to-board thermal resistance (R_JB) of 1.7°C/W. These values can be used to estimate the temperature rise of the device under different operating conditions.

    It is important to note that the thermal resistances of a device can vary depending on a number of factors, including the specific package used, the mounting method, and the ambient temperature.

    Ragards，

    Gary

  • 0 回复 Gary Lu
    Prodigy 10 points

    Thanks for the answer, and I will conservatively use R_JC=1.36, R_JB=1.7 for the simulation.

  • 0 回复 Raffaele Zhang
    TI__Mastermind 27060 points

    Hello，

    Ok, any questions feel free to communicate, I will close this post, thank you!

    Regards，

    Gary